Input Folder
The Input Folder is the same as the Output folder in Compile. That means this is the folder where the VIDEO_TS and AUDIO_TS folders are expected to be.
Device
The DVD recording drive you want to write to, presented as the O/S recognizes it.
Media Type
Set if you want to burn DVD Video or a Mini-DVD.
Mini-DVD is a DVD format burned on the CD-R. Obviously you can put far less data on a CD-R (about 700 MB) than on DVD (4.3 GB)

The size indicator on the bottom can help you to determine how much data you can record to the disc. You have to keep your data below the red area.

Note: While you will be able to play the CD-R on a computer not all standalone players will be able to play the Mini-DVD. In fact such format is not officially supported. The reason is that CD's have far less density of data so in order to play the large DVD video bitrate they have to spin much faster than DVD. Not all DVD drives in players are ready for this so the functionality to DVD files from CD-R is often simply disabled. However a number of Asian or re-branded Asian US models of players use a standard PC type of DVD drive which allows for fast spin of CD.

DVD-RW/DVD+RW Tools
For those using a re-writable media, the DVD-RW needs to be formatted if they were already used - click the Erase/Format button to do this. The more common DVD-R media do not need any formatting.

The DVD-RW and +RW needs to be finalized after writing. This takes quite a large amount of time on RW media. Please be patient until this important process is completed.

Options
Test Write checkbox
Use this option by checking the Test Write checkbox to have DVD-lab do a trial run at writing a DVD. This option does not write anything to disk or your hard drive, it merely goes through the motions to insure that all of the content and menus within the DVD project are correctly prepared and defined.

Volume Name input
Enter here a name for the DVD volume that will appear when placed in a computer drive. A standalone DVD player just ignores this.

Create Image checkbox
You can choose to have DVD-lab create a large file on your hard drive which is an the image of a DVD disc instead of burning. The result will be one big IMG file. That IMG file can be used with a number of third party DVD recording software to replicate a DVD disc from this image file, as many times as you like, whenever you like. Some software will look for a ISO file name extension, if so, just rename the file to a .ISO extension. This method has the advantage of speed as the DVD image is all prepared on your hard drive, it is then a just matter of how fast your DVD burner drive will burn that image.

Hybrid DVD Writing button
You can add additional files and folders to the DVD master disc with the Hybrid DVD Writing option. What this option will do is setup an alternate filesystem on the DVD master disc which is called an ISO filesystem. The ISO format is what a standard CD uses while the DVD video is in UDF/ISO. This is perfectly DVD "legal" as the DVD player doesn't know or care about this ISO filesystem's contents, it just looks for a UDF filesystem.

It doesn't matter at all what the content or nature of these files are. They are just files, not Windows or Mac or Linux files, just files. As they are recorded into the ISO file system domain, they are available on any computer with a DVD drive. This offers the DVD-lab Author some creative options for bonus content that would be available to a computer user on any O/S that supports a DVD drive.



For example, you can create an autorun project in Multimedia Builder and record it to DVD as an extra feature when used on PC. HTML based content may be placed here as well, be sure to indicate to your computer users where to find your HTML starting page (ex: index.html).

Note: The space used by the Hybrid DVD Writing option counts in the entire Project space value. You only get so much space on a DVD (4.7G), this option uses part of that. Do the math to be sure you have room for this extra area.

Write button
As expected, click this button to start the DVD writing (burn) process.

Burn DVD
Menu: Project - Burn DVD from disk

This is the last step in the DVD creation process.


With our DVD Project having been Compiled, there are a set of files that DVD-lab has prepared for you in the Output folder as set in the Compile process. At this point, the DVD Author has choices as to how to convert this set of files into a DVD master disc. You can either use the DVD-lab built-in recording module or you can choose to use a third party DVD recording software such as Nero, Prassi, Gear, etc...



It is common that you are supplied with a DVD recording software that was bundled with your DVD-R/DVD+R burner. This software may be better optimized for your particular drive. The DVD-lab built-in DVD recording module is a general ASPI writing application and should work fine. In an ideal world, either one would work equally well.

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S.E.C.C. Package Type

S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.
S.E.C.C.2 Package Type
The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).

PPGA Package Type
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.

PGA Package Type
PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins.

S.E.P. Package Type
S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to a S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 242 contacts.

OOI Package Type
OOI is short for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.

FC-PGA Package Type
The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.

FC-PGA2 Package Type
FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).

CPU socket
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The Socket 370 processor socket, a ZIF type PGA socketA CPU socket or CPU slot is a connector on a computer's motherboard that accepts a CPU and forms an electrical interface with it. As of 2007, most desktop and server computers, particularly those based on the Intel x86 architecture, include socketed processors.

Most CPU-sockets interfaces are based on the pin grid array (PGA) architecture, in which short, stiff pins on the underside of the processor package mate with holes in the socket. To minimize the risk of bent pins, zero insertion force (ZIF) sockets allow the processor to be inserted without any resistance, then grip the pins firmly to ensure a reliable contact after a lever is flipped.

As of 2007, several current and upcoming socket designs use land grid array (LGA) technology instead. In this design, it is the socket which contains pins. The pins contact pads or lands on the bottom of the processor package.

In the late 1990s, many x86 processors fit into slots, rather than sockets. CPU slots are single-edged connectors similar to expansion slots, into which a PCB holding a processor is inserted. Slotted CPU packages offered two advantages: L2 cache memory could be upgraded by installing an additional chip onto the processor PCB, and processor insertion and removal was often easier. However, slotted packages require longer traces between the CPU and chipset, and therefore became unsuitable as clock speeds passed 500 MHz. Slots were abandoned with the introduction of AMD's Socket A and Intel's Socket 370.

SECOND TRINAL(First Assignment)

Backplane Systems
Backplane systems use a main card with slots to plug all of the PC components into. These systems typically reside in industrial application due to the cost. There are two types of backplane systems, active and passive. The passive system has a main card with slots mounted on the card and no circuitry on the card. Each piece of the PC is mounted on its own card and then plugged into the backplane. An active backplane has some circuitry mounted on the backplane but not a CPU. The card that has the CPU mounted on it is called the processor complex. This setup allows the user to swap or upgrade components very quickly. Unfortunately, there is no standard for the cards that plug into the backplane so you are limited to what the specific manufacturer sells. The backplane systems are all rack mount and the system bus is fixed.
Full-Size AT

NLX.

Boards based on the NLX form factor hit the market in the late 1990's. This "updated LPX" form factor offered support for larger memory modules, tower cases, AGP video support and reduced cable length. In addition, motherboards are easier to remove. The NLX form factor, unlike LPX is an actual standard which means there is more component options for upgrading and repair.

LPX

White ATX is the most well-known and used form factor, there is also a non-standard proprietary form factor which falls under the name of LPX, and Mini-LPX. The LPX form factor is found in low-profile cases (desktop model as opposed to a tower or mini-tower) with a riser card arrangement for expansion cards where expansion boards run parallel to the motherboard. While this allows for smaller cases it also limits the number of expansion slots available. Most LPX motherboards have sound and video integrated onto the motherboard. While this can make for a low-cost and space saving product they are generally difficult to repair due to a lack of space and overall non-standardization. The LPX form factor is not suited to upgrading and offer poor cooling.