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S.E.C.C. Package Type

S.E.C.C. is short for Single Edge Contact Cartridge. To connect to the motherboard, the processor is inserted into a slot. Instead of having pins, it uses goldfinger contacts, which the processor uses to carry its signals back and forth. The S.E.C.C. is covered with a metal shell that covers the top of the entire cartridge assembly. The back of the cartridge is a thermal plate that acts as a heatsink. Inside the S.E.C.C., most processors have a printed circuit board called the substrate that links together the processor, the L2 cache and the bus termination circuits. The S.E.C.C. package was used in the Intel Pentium II processors, which have 242 contacts and the Pentium® II Xeon™ and Pentium III Xeon processors, which have 330 contacts.
S.E.C.C.2 Package Type
The S.E.C.C.2 package is similar to the S.E.C.C. package except the S.E.C.C.2 uses less casing and does not include the thermal plate. The S.E.C.C.2 package was used in some later versions of the Pentium II processor and Pentium III processor (242 contacts).

PPGA Package Type
PPGA is short for Plastic Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PPGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PPGA package is used by early Intel Celeron processors, which have 370 pins.

PGA Package Type
PGA is short for Pin Grid Array, and these processors have pins that are inserted into a socket. To improve thermal conductivity, the PGA uses a nickel plated copper heat slug on top of the processor. The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The PGA package is used by the Intel Xeon™ processor, which has 603 pins.

S.E.P. Package Type
S.E.P. is short for Single Edge Processor. The S.E.P. package is similar to a S.E.C.C. or S.E.C.C.2 package but it has no covering. In addition, the substrate (circuit board) is visible from the bottom side. The S.E.P. package was used by early Intel Celeron processors, which have 242 contacts.

OOI Package Type
OOI is short for OLGA. OLGA stands for Organic Land Grid Array. The OLGA chips also use a flip chip design, where the processor is attached to the substrate facedown for better signal integrity, more efficient heat removal and lower inductance. The OOI then has an Integrated Heat Spreader (IHS) that helps heatsink dissipation to a properly attached fan heatsink. The OOI is used by the Pentium 4 processor, which has 423 pins.

FC-PGA Package Type
The FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.

FC-PGA2 Package Type
FC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the Pentium 4 processor (478 pins).

CPU socket
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The Socket 370 processor socket, a ZIF type PGA socketA CPU socket or CPU slot is a connector on a computer's motherboard that accepts a CPU and forms an electrical interface with it. As of 2007, most desktop and server computers, particularly those based on the Intel x86 architecture, include socketed processors.

Most CPU-sockets interfaces are based on the pin grid array (PGA) architecture, in which short, stiff pins on the underside of the processor package mate with holes in the socket. To minimize the risk of bent pins, zero insertion force (ZIF) sockets allow the processor to be inserted without any resistance, then grip the pins firmly to ensure a reliable contact after a lever is flipped.

As of 2007, several current and upcoming socket designs use land grid array (LGA) technology instead. In this design, it is the socket which contains pins. The pins contact pads or lands on the bottom of the processor package.

In the late 1990s, many x86 processors fit into slots, rather than sockets. CPU slots are single-edged connectors similar to expansion slots, into which a PCB holding a processor is inserted. Slotted CPU packages offered two advantages: L2 cache memory could be upgraded by installing an additional chip onto the processor PCB, and processor insertion and removal was often easier. However, slotted packages require longer traces between the CPU and chipset, and therefore became unsuitable as clock speeds passed 500 MHz. Slots were abandoned with the introduction of AMD's Socket A and Intel's Socket 370.

SECOND TRINAL(First Assignment)

Backplane Systems
Backplane systems use a main card with slots to plug all of the PC components into. These systems typically reside in industrial application due to the cost. There are two types of backplane systems, active and passive. The passive system has a main card with slots mounted on the card and no circuitry on the card. Each piece of the PC is mounted on its own card and then plugged into the backplane. An active backplane has some circuitry mounted on the backplane but not a CPU. The card that has the CPU mounted on it is called the processor complex. This setup allows the user to swap or upgrade components very quickly. Unfortunately, there is no standard for the cards that plug into the backplane so you are limited to what the specific manufacturer sells. The backplane systems are all rack mount and the system bus is fixed.
Full-Size AT

NLX.

Boards based on the NLX form factor hit the market in the late 1990's. This "updated LPX" form factor offered support for larger memory modules, tower cases, AGP video support and reduced cable length. In addition, motherboards are easier to remove. The NLX form factor, unlike LPX is an actual standard which means there is more component options for upgrading and repair.

LPX

White ATX is the most well-known and used form factor, there is also a non-standard proprietary form factor which falls under the name of LPX, and Mini-LPX. The LPX form factor is found in low-profile cases (desktop model as opposed to a tower or mini-tower) with a riser card arrangement for expansion cards where expansion boards run parallel to the motherboard. While this allows for smaller cases it also limits the number of expansion slots available. Most LPX motherboards have sound and video integrated onto the motherboard. While this can make for a low-cost and space saving product they are generally difficult to repair due to a lack of space and overall non-standardization. The LPX form factor is not suited to upgrading and offer poor cooling.

ATX

With the need for a more integrated form factor which defined standard locations for the keyboard, mouse, I/O, and video connectors, in the mid 1990's the ATX form factor was introduced. The ATX form factor brought about many chances in the computer. Since the expansion slots were put onto separate riser cards that plugged into the motherboard, the overall size of the computer and its case was reduced. The ATX form factor specified changes to the motherboard, along with the case and power supply. Some of the design specification improvements of the ATX form factor included a single 20-pin connector for the power supply, a power supply to blow air into the case instead of out for better air flow, less overlap between the motherboard and drive bays, and integrated I/O Port connectors soldered directly onto the motherboard. The ATX form factor was an overall better design for upgrading.
micro-ATXMicroATX followed the ATX form factor and offered the same benefits but improved the overall system design costs through a reduction in the physical size of the motherboard. This was done by reducing the number of I/O slots supported on the board. The microATX form factor also provided more I/O space at the rear and reduced emissions from using integrated I/O connectors.

AT
AT & Baby ATPrior to 1997, IBM computers used large motherboards. After that, however, the size of the motherboard was reduced and boards using the AT (Advanced Technology) form factor was released. The AT form factor is found in older computers (386 class or earlier). Some of the problems with this form factor mainly arose from the physical size of the board, which is 12" wide, often causing the board to overlap with space required for the drive bays.
Following the AT form factor, the Baby AT form factor was introduced. With the Baby AT form factor the width of the motherboard was decreased from 12" to 8.5", limiting problems associated with overlapping on the drive bays' turf. Baby AT became popular and was designed for peripheral devices — such as the keyboard, mouse, and video — to be contained on circuit boards that were connected by way of expansion slots on the motherboard.
Baby AT was not without problems however. Computer memory itself advanced, and the Baby AT form factor had memory sockets at the front of the motherboard. As processors became larger, the Baby AT form factor did not allow for space to use a combination of processor, heatsink, and fan. The ATX form factor was then designed to overcome these issues.
Key Terms To Understanding Motherboard Form Factors
motherboardThe main circuit board of a microcomputer.
form factorThe physical size and shape of a device. It is often used to describe the size of circuit boards.
ATShort for advanced technology, the AT is an IBM PC model introduced in 1984.
ATX